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Send us the part number

What we do

Outcomes, not parts.

Recreating a chip solves one line item. Sustaining a system means owning the whole problem, from the die to the qualified production item, and staying on as the source.

Sustainment partner, not parts supplier

What sets GCI apart

Generic legacy chip providerGCI
Recreates obsolete ICsSolves complete electronic obsolescence problems
Component supplierEngineering and manufacturing partner
Chip replacementSystem sustainment
Individual partsEnd to end production solutions
Device qualificationFull system qualification and production transition
Legacy semiconductor expertiseMicrocircuits, CCAs, packaging, FPGA modernization, testing and manufacturing

Solution areas

Form, fit and function, at every level.

FSC 5962

Microcircuits and hybrids

Known good die recovered from available inventory and reassembled into a new, qualified package, or the device recreated as a monolithic replacement. Same pinout, same behavior, so the next higher assembly never knows.

  • Die extraction from plastic and ceramic packages, with the bond pads intact
  • Hermetic ceramic repackaging in the original footprint
  • Chip scale and custom packages for extracted and new die
  • Monolithic recreation when no donor inventory exists
  • Environmental hardening for temperature, shock and vibration extremes
  • Failure analysis and counterfeit detection on incoming parts
GCI marked hermetic ceramic package with gold leads

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Circuit card assemblies

When a card can no longer be built, GCI reverse engineers it, regenerates the manufacturing drawings, resolves every obsolete component on it, and produces and tests the assembly in house.

  • Board level reverse engineering: delayering, imaging and schematic recovery
  • Redesign around obsolete components without changing the interface
  • Complete manufacturing drawings and technical data package
  • In house assembly and test, including test fixtures and test sets
  • Source Approval Request packages for the new item
  • Production and replenishment for the life of the platform
GCI circuit card assembly with gold hermetic components, Maverick test set power monitor

Custom

FPGA and programmable logic

Function recovered from the original programmable device, recreated in HDL, and implemented on a supportable part inside a package that matches the original footprint and electrical behavior.

  • Design recovery from the original device or bitstream
  • HDL recreation and verification against the original
  • Interposer design to match the original electrical characteristics
  • Drop in package in the original footprint
  • Legacy families: Xilinx, Altera, PAL, GAL and CPLD devices
Open cavity Xilinx XC4013 FPGA with the die and bond wires visible

How it works

From obsolete to available, with one partner.

Most suppliers hand you a part. GCI carries the obsolescence problem through to a qualified, producible item and stays on as the source.

  1. 01

    Obsolescence identified

    You

    Send the part number or NSN, the platform, what technical data exists, the quantity you expect and when you need it.

  2. 02

    Data and hardware assessed

    GCI engineering

    We review the drawings, samples and donor inventory that are actually available, and tell you what is missing.

  3. 03

    Technical feasibility established

    GCI with your program

    An engineering approach, a schedule and a cost basis, before anyone commits funding.

  4. 04

    Replacement engineered

    GCI engineering

    Die reassembly, monolithic recreation, FPGA conversion or a new circuit card, in a form, fit and function package.

  5. 05

    Verification and qualification

    GCI test, your program

    Tested in house to MIL-STD-883 and program requirements, then qualified in the next higher assembly.

  6. 06

    Production and replenishment

    GCI, as the source

    GCI delivers the technical data package, becomes the qualified source of supply and supports the item for the life of the platform.

Engineering depth

Six disciplines, one team.

Obsolescence problems cross boundaries. The engineers do too, and they sit under one roof with the people who build and test the result.

  • 01

    Electrical

    Analog and digital circuit analysis, design and board level redesign.

  • 02

    Mechanical

    Form and fit: footprints, housings, fixtures and thermal paths.

  • 03

    Semiconductor

    Device physics, die level analysis and monolithic recreation.

  • 04

    Packaging

    Hermetic, chip scale and custom packages for extracted and new die.

  • 05

    Reliability

    Screening, failure analysis and qualification to MIL-STD-883.

  • 06

    Manufacturing

    Transition from prototype to repeatable, documented production.

Under one roof

Engineering, manufacturing and test in Colorado Springs.

Reverse engineering, design, packaging, assembly, test and qualification happen in one facility. Prototypes move straight to production, and control of the work stays in the United States.

  • Circuit card assembly under test on a GCI bench with probe leads attached
  • GCI technician at a microscope in the lab
  • GCI test fixture with toggle switches and a circuit card

In house capabilities

Microelectronics

  • IC die extraction from plastic packages
  • Chip scale packaging
  • Hermetic packaging and lid seal
  • Die thinning
  • Wire bonding
  • Stacked die
  • Monolithic recreation
  • Environmental hardening

Board and system

  • Board delayering
  • X-ray analysis
  • Schematic recreation
  • CCA design and manufacturing
  • FPGA design recovery and HDL recreation
  • Manufacturing drawings and TDP creation
  • Source Approval Request packages

Test and qualification

  • MIL-STD-883 assembly and test
  • Failure analysis
  • Test fixture and test set development
  • In house electrical test
  • Qualification to program requirements

Harsh environments

Proven where electronics usually fail.

GCI's packaging technology started in oil and gas downhole drilling, where microcircuits run at +250 °C under 30,000 g. GCI has delivered more than 150,000 production microcircuits into that market, and the same hermetic process now hardens DoD electronics against heat, corrosives and moisture. The repackaged parts pass MIL-STD-883 qualification testing.

+250 °C
Operating temperature
30,000 g
Mechanical stress
150,000+
Production microcircuits delivered

Have an obsolete part on your hands?

Tell us the part number or NSN and the platform. An engineer will scope the path to a replacement.

Send us the part numberor call (719) 573-6777