Resources
The engineering behind the claims.
Papers GCI has presented to the DMSMS and microelectronics communities, the patents behind its processes, and a two minute overview of the company.
Overview
Two minutes on GCI
A short look at the facility and the people, as GCI tells it.
Technical papers and presentations
GCI engages with the technical community.
GCI regularly presents at technical conferences and publishes on die extraction, repackaging and obsolescence resolution.
- Die Extraction and Reassembly ProcessErick Spory · PDF, 10 MB
- A How-To Guide on Addressing and Resolving IC ObsolescenceCharlie Beebout
- NSWC Crane and GCI: A DMSMS Case StudyErick Spory · not available for download
Intellectual property
Patents and trademarks
GCI's innovations in die extraction, repackaging and interconnect are protected by a portfolio of issued U.S. patents. [Confirm count with GCI: sources say 19 to 22.]
Die extraction and repackaging
- US 9,870,968Repackaged Integrated Circuit and Assembly Method
- US 10,177,056Repackaged Integrated Circuit Assembly Method
- US 10,109,606Remapped Packaged Extracted Die
- US 10,177,054Method for Remapping a Packaged Extracted Die
- US 10,115,645Repackaged Reconditioned Die Method and Assembly
Printed bond connections and hermetic packaging
- US 9,935,028Method and Apparatus for Printing Integrated Circuit Bond Connections
- US 9,824,948Integrated Circuit with Printed Bond Connections
- US 10,147,660Repackaged Integrated Circuit with 3D Printed Bond Connections
- US 10,002,8463D Printed Bond Connection Method for Repackaged Integrated Circuit
- US 10,128,1613D Printed Hermetic Package Assembly and Method
- US 10,431,510Hermetic Lid Seal Method and Apparatus
Hardening, interconnect and authentication
- US 9,966,319Environmentally Hardened Integrated Circuit Method and Apparatus
- US 9,711,480Environmentally Hardened Integrated Circuit Method and Apparatus
- US 8,466,371Printed Circuit Board Interconnecting Structure with Compliant Cantilever Interposers
- US 10,654,259Conductive Diamond Application Method and System
- US 11,077,654Conductive Diamond Application System
- US 11,978,711Conductive Diamond Application System
- US 10,460,326IDD Signature (counterfeit detection)
Trademarks
- DER®Die Extraction and Reassembly. U.S. Reg. No. 5,278,571 and 5,215,549
- DEER®U.S. Reg. No. 5,400,012
Have an obsolete part on your hands?
Tell us the part number or NSN and the platform. An engineer will scope the path to a replacement.